IPT1-105-01-S-D-VS-A-TR

IPT1-105-01-S-D-VS-A-TR

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Manufacturer Part IPT1-105-01-S-D-VS-A-TR
Manufacturer Samtec, Inc.
Description CONN HEADER SMD 10POS 2.54MM
Category Connectors, Interconnects
Family Rectangular Connectors - Headers, Male Pins
Lifecycle: New from this manufacturer.
Delivery: DHL FedEx Ups TNT EMS
Payment T/T Paypal Visa MoneyGram Western Union

Availability

InStock 1,081,536
UnitPrice $ 0.00000

IPT1-105-01-S-D-VS-A-TR Current price of is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team rfq@www.zhschip.com

IPT1-105-01-S-D-VS-A-TR Specifications

Type Description
Series:Mini Mate® IPT1
Package:Tape & Reel (TR)
Part Status:Active
Connector Type:Header
Contact Type:Male Pin
Pitch - Mating:0.100" (2.54mm)
Number of Positions:10
Number of Rows:2
Row Spacing - Mating:0.100" (2.54mm)
Number of Positions Loaded:All
Style:Board to Board
Shrouding:Shrouded - 4 Wall
Mounting Type:Surface Mount
Termination:Solder
Fastening Type:Push-Pull
Contact Length - Mating:0.155" (3.94mm)
Contact Length - Post:-
Overall Contact Length:-
Insulation Height:0.250" (6.35mm)
Contact Shape:Square
Contact Finish - Mating:Gold
Contact Finish Thickness - Mating:30.0µin (0.76µm)
Contact Finish - Post:Tin
Contact Material:Phosphor Bronze
Insulation Material:Liquid Crystal Polymer (LCP)
Features:Board Guide
Operating Temperature:-55°C ~ 125°C
Ingress Protection:-
Material Flammability Rating:UL94 V-0
Insulation Color:Black
Current Rating (Amps):2.3A per Contact
Voltage Rating:775VAC, 1095VDC

Shopping Guide

Shipping Rate
Shipping Rate

We ship orders once a day around 5 p.m., except Sundays. Once shipped, the estimated delivery time depends on the courier company you choose, usually 5-7 working days.

Shipping Methods
Shipping Methods

We provide DHL, FedEx, UPS, EMS, SF Express, and Registered Air Mail international shipping.


Payment
Payment

TT in advance (bank transfer), Western Union,PayPal. Customer is responsible for shipping fee, bank charges, duties and taxes.

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